Assembly Processes

The in-house availability of the whole assembly process allows MEAS Switzerland to develop and produce sensor packaged to ideally fit to customer needs. Many of our sensor dice are also avalaible  as surface-mounted devices (SMD) , for assembly of our sensor in automatic SMD pick-and-place mounting lines. Ceramic or PCB substrate are used to address all type of applications from specialy harsh conditions or high precision requirements to the high volume / low cost needs.

The MS5540 altimeter module or MS5541 high pressure module for dive computers are mounted on a ceramic substrat with a special protective gel and offers MEAS Switzerland excellent digital pressure solution as a ready to use, top quality assembly.

For higher volumes application such as GPS or mobile phones requiring smaller footprints the MS5561 micro altimeter module is mounted on a PCB substrate with a metal cap.

For medical instrumentation, pneumatic controls or other applications which require relative (gage) pressure measurements the MS5201D SMD Pressure Sensor mounted on a ceramic substrate offers a plastic cap with a port to connect plastic tubing.