Services

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With 10 years of experience in MEMS sensor manufacturing MEAS Switzerland is able to offer its know-how and expertise in several MEMS and electronics fabrication processes using its highly automatised production line.

Process steps range from micromachining to sensor and IC packaging and include screen-printing, wire-bonding, die-bonding, pressure and temperature calibration and test, Automated Optical Inspection (AOI) of wafers as well as laser serialization and marking.

Our engineer task force will be happy to discuss your project and provide tightly scheduled solutions adapted to your out-sourcing needs.

 

Wafer Service

Micro-machining

  • Chemical wafer etching
  • Time etch or etch control based on Epi-layer
  • Plasma cleaning
  • Anodic wafer bonding
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Wafer Dicing

  • 4', 6', 8' wafers
  • Wafer on standard blue foil or UV tape

Assembly and Packaging

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Screen printing

  • On ceramics and PCB
  • Conductive and dielectric materials
  • Adhesives
  • Solder paste
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Wire-Bonding

  • Ultrasonic Au wire bonding
  • Up to 4' x 4' substrates
  • Ceramics and PCB
  • Special processes as Bond Stitch on Ball (BSOB) and Bond Ball on Stitch (BSOB)
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Die-attach

  • 6 inches wafers
  • On Ceramics and PCB
  • Upward camera, dipping, stamping

Encapsulation

  • Underfill
  • Damm and fill
  • Protective gels
  • Time-pressure-dispensing or Archimedean screw

Laser Marking and Trimming

  • For ceramics, PCB, plastics, metal
  • Resistors trimming

Control and Test

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Test and Calibration

  • Calibration and test in P-T-Space for modules
  • P = 50 mbar ... 14 bar
  • T = 15°C ... 60°C
  • SPI or I2C

Automated Optical Inspection (AOI) for wafers

  • 4', 6', 8' wafers
  • Single and double sided
  • Results as wafer map or inking of dice